International Integrated Circuit Innovation Expo (IICIE 2026) as a premier platform for the semiconductor industry, showcases the full industry ecosystem, including IC products and applications, wafer manufacturing, packaging and testing, semiconductor equipment, semiconductor materials and key components, etc. 


IICIE 2026 enables direct engagement with key players in semiconductor sectors including IDM, Fabless, Fab and OSAT. It also attracts global professionals from AI, consumer electronics, automotive, communications & computing, display, photonics, new energy and other fields, delivering one-stop business connections, matchmaking, and industry exchanges.


Highlights:
Co-located EventBooth Application
Exhibit Profile

Chip

AI Chip, Communication Chip, Memory Chip, CPU Chip, Sensor Chip, Analog Chip, Digital Chip, Power Management and Power Chip, RF Chip, Driver Chip, etc.

Design /Manufacturing

IP / EDA (Electronic Design Automation), Fabless, Foundry, OSAT (Outsourced Semiconductor Assembly and Testing), Testing Services, etc.

Semiconductor Equipment

Fabrication Equipment, Packaging Equipment, Inspection and Testing Equipment, Assembly Equipment, Environmental Control Equipment, Factory Automation / Robots, etc.

Semiconductor Material

Substrate Material, Manufacturing Material, Packaging Material, etc.

Semiconductor Core Parts

Sealing Ring, Precision Bearing, Metal Part, Quartz / Silicon / Sic / Ceramic Component, Power Supply (RF Power Supply, DC Power Supply, Plasma Power Supply, Etc.), Stepper Motor / Motion Control / Servo Motor, Pump / Semiconductor Valve / Pressure, Electrostatic Chuck, Flow Meter, Machine Vision, Sensor, Linear Motor, etc.

Compound Semiconductor and Power Device

Silicon Carbide (SiC), Gallium Nitride (GaN), Diamond, Gallium Oxide (Ga₂O₃), Cubic Boron Nitride (cBN), Aluminum Nitride (AlN), Graphite and Carbon Materials, Power Device, etc.

Visiting Companies
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