About IICIE
International Integrated Circuit Innovation Expo (IICIE 2026) as a premier platform for the semiconductor industry, showcases the entire ecosystem across chip & IC design, semiconductor manufacturing, packaging & testing equipment, core parts and material.
IICIE 2026 enables direct engagement with key players in semiconductor sectors including IDM, fabless, fab and OSAT. It also attracts global professionals from AI, consumer electronics, automotive, communications & computing, display, photonics, new energy and other industries, delivering one-stop business connections, matchmaking, and industry exchanges.
IICIE 2026 enables direct engagement with key players in semiconductor sectors including IDM, fabless, fab and OSAT. It also attracts global professionals from AI, consumer electronics, automotive, communications & computing, display, photonics, new energy and other industries, delivering one-stop business connections, matchmaking, and industry exchanges.
Time: September 9-11, 2026
Venue: Shenzhen World Exhibition and Convention Center, China
Featured Halls
Chip / IC Design, Semiconductor Packaging
and Testing Hall
- IC chip, design / electronic design, automation services (EDA & IP), outsourced semiconductor assembly and testing services (OSAT), packaging & testing equipment, packaging materials and consumable / core parts
IC Fabrication Hall
- IC fabrication & foundry, IC manufacturing equipment, metrology equipment, substrate & manufacturing material & consumable, core parts
Compound Semiconductor Hall
- power device and module, material and substrate, manufacturing equipment, packaging and testing equipment, core parts
Featured Zones
- Chip Application Zone
Showcasing automotive electronics, HPC, and smart wearables, this zone connects chip suppliers, solution providers and terminal developers to facilitate business matching. Onsite product demonstrations and technical sessions will demonstrate the integration of AI computing with automotive, wearable, and high-performance computing scenarios.
- RISC-V Ecosystem Zone
Focusing on open-source architecture, HW/SW co-design and full-stack implementation, this zone displays a comprehensive RISC-V ecosystem spanning IP, processor, operating system and applications for AI, automotive, industrial, and data center. It presents a one-stop showcase of how open-source chips drive edge-cloud integrated computing, automotive chip and edge AI, creating new possibilities for intelligent computing.
Exhibitor Profile
-
ChipAI chip, communication chip, memory chip, CPU chip, sensor chip, analog chip, digital chip, power management and power chip, RF chip, driver chip, etc. -
IC Design / Manufacturing ServiceEDA / IP (electronic design automation), fabless, foundry, OSAT (outsourced semiconductor assembly and testing), testing services, etc. -
Semiconductor Equipmentmanufacturing equipment, packaging equipment, inspection and testing equipment, assembly equipment, environmental control equipment, factory automation / robot, etc. -
Semiconductor Materialsubstrate material, manufacturing material, packaging material, etc. -
Semiconductor Core Partssealing ring, precision bearing, metal part, quartz /silicon / SiC (Silicon Carbide) / ceramic component, power supplies (RF power supply, DC power supply, plasma power supply, etc.), stepper motor / motion control / servo motor, pump / semiconductor valve / pressure, electrostatic chuck, flow meter, machine vision, sensor, linear motor, etc. -
Compound Semiconductor & Power DeviceSilicon Carbide (SiC), Gallium Nitride (GaN), diamond, Gallium Oxide (Ga₂O₃), Cubic Boron Nitride (cBN), Aluminum Nitride (AlN), graphite & carbon material, power device, etc.
Co-located Event
IICIE will be co-located with the 27th China International Optoelectronic Exposition (CIOE 2026) and Shenzhen International Electronics & Embedded Expo (elexcon 2026), jointly creating a mega event spanning 340,000 square meters for the semiconductor, optoelectronic & photonic and electronics & embedded systems industry chains.
CIOE 2026 covers the entire optoelectronics ecosystem, showcasing 8 featured sub expos covering sectors such as information and communication, optics, laser, infrared, sensing, display, AR & VR, photonic, etc.
elexcon 2026 will showcase embedded AI and edge AI, memory, SoC/MCU/MPU, wireless technology, MEMS sensors, power management IC, power device, industrial power supply, passive component, and advanced packaging solutions including SiP and Chiplet..
This unique convergence creates a “Chips + Core Devices + Equipment & Solutions” full-industry-chain platform that unlocks unprecedented cross-sector collaboration opportunities.
CIOE 2026 covers the entire optoelectronics ecosystem, showcasing 8 featured sub expos covering sectors such as information and communication, optics, laser, infrared, sensing, display, AR & VR, photonic, etc.
elexcon 2026 will showcase embedded AI and edge AI, memory, SoC/MCU/MPU, wireless technology, MEMS sensors, power management IC, power device, industrial power supply, passive component, and advanced packaging solutions including SiP and Chiplet..
This unique convergence creates a “Chips + Core Devices + Equipment & Solutions” full-industry-chain platform that unlocks unprecedented cross-sector collaboration opportunities.
Program
IICIE will concurrently hold over 20 forums and conferences, focusing on key topics such as chip and chip application, semiconductor manufacturing, advanced packaging and testing, compound semiconductor, and intelligent manufacturing, etc. These forums will showcase the technologies and achievements of the integrated circuit industry. Through face-to-face interactions and in-depth technical discussions, they offered valuable insights and key references to support enterprises in their strategic planning and development. Conference List
Subscribe Us
To better understand IICIE, exhibitors and showcase products, we will provide a series of semiconductor product brochures, and regularly send the latest industry information, exhibition information, industry reports, etc.
Key Visiting Companies
- EDA/IP ACTT, EMPYREAN, HCHIPLET SEMICONDUCTOR, PRIMARIUS, RONG SEMICONDUCTOR, SEMITRONIX, SICHIP, SIEMENS EDA, SPLENDOR, SYNOPSYS, UNIVISTA, XPEEDIC...
- Fabless & IDM BASIC SEMICONDUCTOR, BIWIN, BYD, C*CORE, CHIPON MICROELECTRONICS, CHIPPACKING, CXMT, DOSILICON, ELLON , EVERBRIGHT, FINE MADE MICRO, GEEHY, GOOGLE, GOERMICRO, GOODIX, GUOXIN MICRO, HANWEI ELECTRONICS, HISILICON, IBM, INTELLIFUSION, KAIFA, LONGSYS, NSING, NVIDIA, SANAN OPTOELECTRONICS, SANECHIPS, SGKS, SIGMASTAR, SILAN, SONY, STARFIVE, STMICROELECTRONICS, STS, UNISOC, VALEO, VIMICRO...
- Foundry CR MICRO, GLOBALFOUNDRIES, HUAHONG, NEXCHIP, SAMSUNG FOUNDRY, SMIC, HLMC, TOWER SEMICONDUCTOR, PENGXINWEI...
- OSAT BLUE ROCKET ELECTRONICS, CAPCON, CHIPMORE, CHIPPACKING, FHEC, GUANGDONG 3D-SEMI, HISEMI, HT-TECH, JCET, KAIFA, LEADYO, NCAP CHINA, SHENGYUAN SEMICONDUCTOR, SINOIC, SJ SEMI, TIANCHENG, TONGFU MICROELECTRONICS, UNIONSEMICON, V-TEST, WISE ROAD CAPITAL, WLCSP, YUNTIAN...
- Semiconductor Equipment AFILM, AIT, ALLSEMI, ASPIRING, CCTECH, CETC 13 , CETC 45 , CHOTEST, DJEL, DREAM LAUNCH, FMSH, GLOBALFOUNDRIES, HAYUE SEMICONDUCTOR , HSET, HUATUO SEMICONDUCTOR , HUAV, HWATSING , HYMSON, KINGSEMI, LEIBOSEMI, LIANDE, MACROTEST SEMICONDUCTOR TECHNOLOGY, MAGIC-RAY, MAXWELL, MINTEST, MOSART , MQL, NASO TECH, NEXCHIP, S.C NEW ENERGY TECHNOLOGY, SIDEA, SKYVERSE, SUNNY INSTRUMENTS, TAIYAN SEMI EQUIPMENT, T-VISION, XINYICHANG TECHNOLOGY, YUWEITEK, ZHENGYE TECHNOLOGY, ZHIZHENG HOLDING...
- Semiconductor Material ANCHUTECH, CCTC, DINGLONG, ESWIN, GEMCH, GRIKIN, HUALUN CHEMICAL, HUATE GAS, JINGJIUMC, KFMI, LUYUANSCI & TECH, MITSUI HIGH-TEC, NATA OPTO-ELECTRONIC MATERIAL, NEWWAY, PERIC, QINGYI, RONGDA, SINOPACK ELECTRONIC, SINYANG SEMICONDUCTOR, SQ GROUP, SUNTIFIC, SYTECH, TDG, WANHUA CHEMICAL, YIXIN SEMICONDUCTOR, ZHONGWEI LIHE...
- Semiconductor Core Parts AMS, BWT, COHERENT, FORTUNE PRECISION, GENTECH, GLOBAL TECHNOLOGY, GZ PHOTONICS, HANBELL, INNO LASER, JIENUOTE, KFMI, KINGLAI, KSTAR, MLOPTIC, OFILM, SCHAEFFLER, SHIJIA PHOTONS, TZTEK, U-PRECISION, VITAL MATERIALS...
- Compound Semiconductor PUSHING, CCMC, DOGAIN, ICEMOS, PURECHIP, SICC, TANKEBLUE, ZINGSEMI...
- Power Semiconductor AST, ASCENPOWER, BELLING, INVSEMI, INVT, JJMICROELECTRONICS, MITSUBISHIELECTRIC, MURATA, NEXPERIA, TBEA, UNIMICRON, WEEN SEMICONDUCTORS...
Fairground Map
Exhibitor List
Product List
