About IICIE
International Integrated Circuit Innovation Expo (IICIE 2027), as a premier platform for the semiconductor industry, showcases the entire ecosystem across chip & IC design, semiconductor manufacturing, packaging & testing equipment, core parts and material. IICIE 2027 enables direct engagement with key players in semiconductor sectors including IDM, fabless, fab and OSAT. It also attracts global professionals from AI, consumer electronics, automotive, communications & computing, display, photonics, new energy and other industries, delivering one-stop business connections, matchmaking, and industry exchanges.
Time: September 8-10, 2027
Venue: Shenzhen World Exhibition and Convention Center, China
Featured Zones
Chip Application Zone
RISC-V Ecosystem Zone
Chip Zone
IWAPS Lithography Zone
University & Research Institute Zone
Exhibitor Profile
IC Design/IP/EDA
Chip & Semiconductor Device
Wafer Fabrication, Semiconductor Packaging & Testing Service
Semiconductor Equipment
Metrology, Inspection & Testing
Semiconductor Material & Consumables
Compound Semiconductor
Semiconductor Core Parts & Subsystems
Factory Automation & Robotics
Facility, Cleanroom & Line Engineering
Research Institute
R&D Service | Industry Support & Service
Program
IICIE will host more than 20 concurrent forums and conferences, focusing on key topics such as semiconductor manufacturing, advanced packaging, compound semiconductor, intelligent manufacturing, and green facility management. These forums will showcase technologies and breakthroughs across the integrated circuit ecosystem. Through face-to-face interactions and in-depth technical discussions, they will deliver valuable insights and key references to support enterprises with strategic planning and development. Conference List
Co-located Event
IICIE will be co-located with
CIOE 2027 covers the entire optoelectronics ecosystem, showcasing 8 featured sub expos covering sectors such as information and communication, optics, laser, infrared, sensing, display, AR & VR, photonic, etc.
elexcon 2027 will showcase embedded AI and edge AI, memory, SoC/MCU/MPU, wireless technology, MEMS sensors, power management IC, power device, industrial power supply, passive component, and advanced packaging solutions including SiP and Chiplet..
This unique convergence creates a “Chips + Core Devices + Equipment & Solutions” full-industry-chain platform that unlocks unprecedented cross-sector collaboration opportunities.
the 28th China International Optoelectronic Exposition (CIOE 2027)
and Shenzhen International Electronics & Embedded Expo (elexcon 2027), jointly creating a mega event spanning 320,000 square meters for the semiconductor, optoelectronic & photonic and electronics & embedded systems industry chains.CIOE 2027 covers the entire optoelectronics ecosystem, showcasing 8 featured sub expos covering sectors such as information and communication, optics, laser, infrared, sensing, display, AR & VR, photonic, etc.
elexcon 2027 will showcase embedded AI and edge AI, memory, SoC/MCU/MPU, wireless technology, MEMS sensors, power management IC, power device, industrial power supply, passive component, and advanced packaging solutions including SiP and Chiplet..
This unique convergence creates a “Chips + Core Devices + Equipment & Solutions” full-industry-chain platform that unlocks unprecedented cross-sector collaboration opportunities.
Subscribe Us
To better understand IICIE, exhibitors and showcase products, we will provide a series of semiconductor product brochures, and regularly send the latest industry information, exhibition information, industry reports, etc.
Key Visiting Companies
- Semiconductor Equipment ACM RESEARCH, ASMPT, AMEC, AMIES, APPLIED MATERIALS, CHANGCHUAN TECHNOLOGY, DISCO, FORTREND, HOSON, NASO TECH, HWATSING TECHNOLOGY, JINGCE ELECTRONICS, NAURA, SICARRIER, SIDEA, SMEE, TZTEK
- Fabless & IDM BYD SEMICONDUCTOR, CHIPSEA, CR MICRO, CXMT, EVERBRIGHT, GALAXYCORE, GUOXIN MICRO, HISILICON, LONGSYS, NEXPERIA, SAMSUNG SEMICONDUCTOR, ST MICROELECTRONICS, SK HYNIX, SILAN, T-HEAD SEMICONDUCTOR, UNISOC, YMTC, ZTE MICROELECTRONICS
- Optoelectronics AAC OPTICS, ACCELINK, COHERENT, EAGLE SEMICONDUCTOR, EOPTOLINK, EVERBRIGHT, EVERPROX, FOCTEK, INNOLIGHT, LIANCHUANG ELECTRONICS, LIOBATE, PHENIX OPTICS, SHIJIA PHOTONS, SUNNY GROUP, TRUMPF, UNION OPTECH, UX FASTUC, YUANJIE SEMICONDUCTOR, YUTONG OPTICAL
- Information and Communication ADVANTECH, BYTEDANCE, CHINA MOBILE, CHINA TELECOM, FOXCONN, FUJITSU, HUAWEI, H3C, HYTERA, INSPUR, KINGSOFT CLOUD, RUIJIE NETWORKS, SHANGHAI NOKIA, SUGON, TENCENT, ZTE, ZONGHENG COMMUNICATION
- Foundry & OSAT CANSEMI, CHIPPACKING, FENGHUA SEMCONDUCTOR, GLOBALFOUNDRIES, GTA SEMICONDUCTOR, HUAHONG GROUP, HUAXIN MICRO-ELECTRONICS, HT-TECH, JCET, LEADYO, NEXCHIP, PAYTON TECHNOLOGY, PENGXINWEI, PENGXINXU, RUNPENG SEMICONDUCTOR, TIANCHENG, TONGFU MICROELECTRONICS, TOWER SEMICONDUCTOR, SMIC, SAMSUNG SEMICONDUCTOR, SJ SEMI, UNT XMC, YANDONG MICROELECTRONICS, ZENGXIN TECHNOLOGY
- Semiconductor Material ANJI MICROELECTRONICS, FASTPRINT, G-GAS, GRINM GROUP, HUATE GAS, INNOSCIENCE, JINGRUI-CHEM, KFMI, NEWWAY, NSIG, OMAT, SUMITOMO ELECTRIC, SHANGHAI SINYANG, SUMMITCRYSTAL, SCC, TANKEBLUE, TYSIC
- Power Semiconductor ASCENPOWER, BASIC SEMICONDUCTOR, BELLING, CRRC, GANEXT, INNOSCIENCE, INFINEON, NATIONALCHIP, NEXPERIA, NXP, MITSUBISHI ELECTRIC, ONSENMEI, ROHM, SILAN MICROELECTRONICS, SISEMI, YANGJIE TECHNOLOGY
- Consumer Electronics APPLE, AMAZON, DJI, HUAWEI, HUAQIN, IFLYTEK, LENOVO, OPPO, SONY, TRANSSION, XIAOMI, VIVO
- Automotive BAIC MOTOR TECHNICAL CENTER, BYD AUTO, CHERY, DESAY SV, GAC GROUP, GEELY AUTO, GREAT WALL MOTOR, HORIZON ROBOTICS, LI AUTO, LONGCHEER, VALEO, VOYAH, ZEEKR
- Research Institute GIICS, GUANGDONG INSTITUTE OF SEMICONDUCTOR MICRO-NANO MANUFACTURING TECHNOLOGY, INSTITUTE OF SEMICONDUCTORS (GDAS), IMECAS, SLAB, SIMIT, SIATCAS, JHL, PCL, ZHEJIANG LAB
* Partial list in alphabetical order
Exhibitor List
Product List
