About IICIE
International Integrated Circuit Innovation Expo (IICIE 2026) as a premier platform for the semiconductor industry, showcases the entire ecosystem across IC design, semiconductor manufacturing & packaging equipment, core parts and materials.
IICIE 2026 enables direct engagement with key players in semiconductor sectors including IDM, Fabless, Fab and OSAT. It also attracts global professionals from AI, consumer electronics, automotive, communications & computing, display, photonics, new energy and other fields, delivering one-stop business connections, matchmaking, and industry exchanges.
IICIE 2026 enables direct engagement with key players in semiconductor sectors including IDM, Fabless, Fab and OSAT. It also attracts global professionals from AI, consumer electronics, automotive, communications & computing, display, photonics, new energy and other fields, delivering one-stop business connections, matchmaking, and industry exchanges.
Time: September 9-11, 2026
Venue: Shenzhen World Exhibition and Convention Center, China
Featured Halls
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Chip /IC Design, Semiconductor Packaging and Testing Hall IC Chips, Design/Electronic Design, Automation Services (EDA&IP), Outsourced Semiconductor Assembly and Testing Services (OSAT), Packaging Equipment/Test Equipment, Packaging Materials and Consumables/Core Components, Featured Zones (AI Computing Power and Application, Advanced Packaging, Advanced Computing) -
IC Fabrication HallIC Fabrication & Foundry, IC Manufacturing Equipment, Metrology Equipment, Substrate & Manufacturing Materials & Consumables, Core Components & Parts, Featured Zone (Achievements from Universities & Research Institutes) -
Compound Semiconductor HallPower Devices and Modules, Materials and Substrates, Manufacturing Equipment, Packaging and Testing Equipment, Core Components, Featured Zone (Automotive Chip And Power Semiconductor)
Exhibitor Profile
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ChipAI chips, communication chips, memory chips, CPU chips, sensor chips, analog chips, digital chips, power management and power chips, RF chips, driver chips, etc. -
IC Design / Manufacturing ServiceIP/EDA (Electronic Design Automation), fabless, foundry, OSAT (Outsourced Semiconductor Assembly and Testing), testing services, etc. -
Semiconductor Equipmentmanufacturing equipment, packaging equipment, inspection and test equipment, assembly equipment, environmental control equipment, factory automation / robot, etc. -
Semiconductor Materialsubstrate material, manufacturing material, packaging material, etc. -
Semiconductor Core Partssealing ring, precision bearing, metal part, quartz /silicon / SiC (Silicon Carbide) / ceramic component, power supplies (RF power supply, DC power supply, plasma power supply, etc.), stepper motor / motion control / servo motor, pump / semiconductor valve / pressure, electrostatic chuck, flow meter, machine vision, sensor, linear motor, etc. -
Compound Semiconductor & Power DeviceSilicon Carbide (SiC), Gallium Nitride (GaN), diamond, Gallium Oxide (Ga₂O₃), Cubic Boron Nitride (cBN), Aluminum Nitride (AlN), graphite & carbon material, power device, etc.
Co-located Event
IICIE will co-locate with the The 27th China International Optoelectronic Exposition (CIOE 2026) and Shenzhen International Electronics & Embedded Expo (elexcon 2026), jointly creating a mega event spanning 340,000 square meters for the optoelectronic, semiconductor and electronics & embedded systems industry chains.
CIOE 2026 covers the entire optoelectronics ecosystem, showcasing 8 featured sub expos covering sectors such as information and communication, precision optics, laser and intelligent manufacturing, infrared, intelligent sensing, display technologies, AR & VR, photonic innovation etc.
elexcon 2026 will showcase embedded AI and edge AI, memory, SoC/MCU/MPU, wireless technologies, MEMS sensors, power management ICs, power devices, industrial power supplies, passive components, and advanced packaging solutions including SiP and Chiplet.
The co-located exhibitions synergize cross-industry applications including consumer electronics, intelligent automotive, robotics, AR/VR, communications, medical electronics, defense/security and display, and catering channel resources of solution providers, system integrators, agents and distributors.
CIOE 2026 covers the entire optoelectronics ecosystem, showcasing 8 featured sub expos covering sectors such as information and communication, precision optics, laser and intelligent manufacturing, infrared, intelligent sensing, display technologies, AR & VR, photonic innovation etc.
elexcon 2026 will showcase embedded AI and edge AI, memory, SoC/MCU/MPU, wireless technologies, MEMS sensors, power management ICs, power devices, industrial power supplies, passive components, and advanced packaging solutions including SiP and Chiplet.
The co-located exhibitions synergize cross-industry applications including consumer electronics, intelligent automotive, robotics, AR/VR, communications, medical electronics, defense/security and display, and catering channel resources of solution providers, system integrators, agents and distributors.
Program
IICIE will concurrently hold over 20 forums and conferences, focusing on critical topics such as Chips & Chip Design, Wafer Fabrication & Advanced Packaging, Compound Semiconductors & Power Devices, and Intelligent Manufacturing. These forums will showcase the technologies and achievements of the integrated circuit industry. Through face-to-face interactions and in-depth technical discussions, they offered valuable insights and key references to support enterprises in their strategic planning and development. Conference List
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To better understand IICIE, exhibitors and showcase products, we will provide a series of semiconductor product brochures, and regularly send the latest industry information, exhibition information, industry reports, etc.
Key Visiting Companies
- EDA/IP ACTT, EMPYREAN, HCHIPLET SEMICONDUCTOR, PRIMARIUS, RONG SEMICONDUCTOR, SEMITRONIX, SICHIP, SIEMENS EDA, SPLENDOR, SYNOPSYS, UNIVISTA, XPEEDIC...
- Fabless & IDM BASIC SEMICONDUCTOR, BIWIN, BYD, C*CORE, CHIPON MICROELECTRONICS, CHIPPACKING, CXMT, DOSILICON, ELLON , EVERBRIGHT, FINE MADE MICRO, GEEHY, GOOGLE, GOERMICRO, GOODIX, GUOXIN MICRO, HANWEI ELECTRONICS, HISILICON, IBM, INTELLIFUSION, KAIFA, LONGSYS, NSING, NVIDIA, SANAN OPTOELECTRONICS, SANECHIPS, SGKS, SIGMASTAR, SILAN, SONY, STARFIVE, STMICROELECTRONICS, STS, UNISOC, VALEO, VIMICRO...
- Foundry CR MICRO, GLOBALFOUNDRIES, HUAHONG, NEXCHIP, SAMSUNG FOUNDRY, SMIC, HLMC, TOWER SEMICONDUCTOR, PENGXINWEI...
- OSAT BLUE ROCKET ELECTRONICS, CAPCON, CHIPMORE, CHIPPACKING, FHEC, GUANGDONG 3D-SEMI, HISEMI, HT-TECH, JCET, KAIFA, LEADYO, NCAP CHINA, SHENGYUAN SEMICONDUCTOR, SINOIC, SJ SEMI, TIANCHENG, TONGFU MICROELECTRONICS, UNIONSEMICON, V-TEST, WISE ROAD CAPITAL, WLCSP, YUNTIAN...
- Semiconductor Equipment AFILM, AIT, ALLSEMI, ASPIRING, CCTECH, CETC 13 , CETC 45 , CHOTEST, DJEL, DREAM LAUNCH, FMSH, GLOBALFOUNDRIES, HAYUE SEMICONDUCTOR , HSET, HUATUO SEMICONDUCTOR , HUAV, HWATSING , HYMSON, KINGSEMI, LEIBOSEMI, LIANDE, MACROTEST SEMICONDUCTOR TECHNOLOGY, MAGIC-RAY, MAXWELL, MINTEST, MOSART , MQL, NASO TECH, NEXCHIP, S.C NEW ENERGY TECHNOLOGY, SIDEA, SKYVERSE, SUNNY INSTRUMENTS, TAIYAN SEMI EQUIPMENT, T-VISION, XINYICHANG TECHNOLOGY, YUWEITEK, ZHENGYE TECHNOLOGY, ZHIZHENG HOLDING...
- Semiconductor Material ANCHUTECH, CCTC, DINGLONG, ESWIN, GEMCH, GRIKIN, HUALUN CHEMICAL, HUATE GAS, JINGJIUMC, KFMI, LUYUANSCI & TECH, MITSUI HIGH-TEC, NATA OPTO-ELECTRONIC MATERIAL, NEWWAY, PERIC, QINGYI, RONGDA, SINOPACK ELECTRONIC, SINYANG SEMICONDUCTOR, SQ GROUP, SUNTIFIC, SYTECH, TDG, WANHUA CHEMICAL, YIXIN SEMICONDUCTOR, ZHONGWEI LIHE...
- Semiconductor Core Parts AMS, BWT, COHERENT, FORTUNE PRECISION, GENTECH, GLOBAL TECHNOLOGY, GZ PHOTONICS, HANBELL, INNO LASER, JIENUOTE, KFMI, KINGLAI, KSTAR, MLOPTIC, OFILM, SCHAEFFLER, SHIJIA PHOTONS, TZTEK, U-PRECISION, VITAL MATERIALS...
- Compound Semiconductor PUSHING, CCMC, DOGAIN, ICEMOS, PURECHIP, SICC, TANKEBLUE, ZINGSEMI...
- Power Semiconductor AST, ASCENPOWER, BELLING, INVSEMI, INVT, JJMICROELECTRONICS, MITSUBISHIELECTRIC, MURATA, NEXPERIA, TBEA, UNIMICRON, WEEN SEMICONDUCTORS...
Fairground Map
Exhibitor List
Product List
