From September 9-11, 2026, three flagship industry events will take place concurrently at the Shenzhen World Exhibition & Convention Center, China: the International Integrated Circuit Innovation Expo (IICIE 2026), the 27th China International Optoelectronic Exposition (CIOE 2026), and the 23rd Shenzhen International Electronics & Embedded Systems Expo (elexcon 2026).
This unprecedented tri-show will span 320,000 square meters, bringing together over 5,000 exhibitors and attracting more than 240,000 industry professionals. Together, these events create a premier platform that seamlessly integrates technology showcases, industry networking, and commercial partnerships, driving powerful innovation momentum across optoelectronics, integrated circuits, electronics, and embedded systems.
The exhibitions focus on four strategic technologies: AI computing power, consumer electronics & AR/VR, intelligent automotive and embodied robot, semiconductor and intelligent manufacturing. By connecting upstream and downstream technologies, supply chains, and business opportunities, the events accelerate cross-industry innovation and drive deeper value chain convergence.
The large-scale deployment of AI computing power represents a comprehensive systematic initiative encompassing chips, servers, high-speed interconnections, mass storages, intelligent computing power supplies, and data center clusters. This ecosystem is built upon four core industrial pillars: photonics, storage, electronics and chips. The three co-located exhibitions feature well-defined positioning and complementary convergence, covering the full-spectrum requirements of computing infrastructure:
- Photonics: The Foundational Backbone for High-Speed Optical Interconnect of Computing Clusters
Photonics technology addresses the critical demand for ultra-high-speed data transmission between servers during large-scale model training and inference, serving as the core carrier for interconnection of computing networks. - Storage: The Core Infrastructure for Massive AI Data
Storage solutions support massive data storage and high-throughput read-write requirements for large-scale models, effectively eliminating storage bandwidth bottlenecks in computing scenarios. - Electronics: Stable & Energy-Efficient Support for Intelligent Computing Centers
Electronics systems provide high-efficiency power supplies, power devices and thermal management solutions for large-scale computing clusters, significantly reducing energy consumption in computing operations. - Chips: The Fundamental Ceiling of AI Computing Performance
GPU, ASIC, SoC, advanced packaging technologies, and semiconductor process materials define the fundamental capabilities of computing hardware.
- International Integrated Circuit Innovation Expo (IICIE) ——As a professional exhibition platform spanning the entire semiconductor industrial chain, IICIE underpins comprehensive fundamental manufacturing processes. Beyond core AI chips, the exhibition features key semiconductor materials, wafer fabrication equipment, packaging & testing equipment, 2.5D/3D advanced packaging, hybrid bonding heterogeneous integrations, and other cutting-edge technologies and products, exploring how advanced packaging technologies overcome the "memory wall" limitations of chips in the AI computing era.
Featured Exhibitors
- Wafer Fabrication and Packaging Service: HLMC, Nexchip, BYD SEMICONDUCTOR, TONGFU MICROELECTRONICS, MXTronics, BIWIN Storage Technology, Centraway, iA Semiconductor;
- Semiconductor Equipment: NAURA, AMEC, ACM RESEARCH, PIOTECH, Heyan Technology, Hwatsing, Aspiring, Huayu Semiconductor, Longyoude, Jingce Electronic, CETC, U-PRECISION, SKYVERSE, Maxwell, DJEL;
- Semiconductor Material: NSIG, Anji Microelectronics, Peric, Shanghai Sinyang, UPERMARSK, XILONG SCIENTIFIC, Chengdu Carbon.
- China International Optoelectronic Exposition (CIOE)——Information and Communication Expo focuses on the core technologies for high-speed data transmission. It showcases high-speed optical modules, LPO/NPO/CPO solutions, high-performance optical chips, OCS all-optical switches, high-speed connectors for computing networking, optical test & measurement equipment, and passive optical components, covering the complete value chain of intelligent computing interconnection.
Featured Exhibitors
- Optical Chips: COHERENT, MITSUBISHI ELECTRIC, SICOYA, SIFOTONICS, WD PHOTONICS, PHOGRAIN, QXP, LIOBATE, EVERBRIGHT, Silux, Xphor, China Science Photon Chip, Shijia Photons, ETERN-LASER, CIG, ELITE OPTRONICS, Xizhi Technology...
- Optical Module: HiSilicon, Accelink, HGGENUINE, Eoptolink, Ligent, CIG, Luxshare, Linktel, Pioseed, Taclink, O-Net, EverProX, Sont, COHERENT, SOURCE PHOTONICS, Tri-Light...
- Optical Fiber Cable: CORNING, YOFC, hengtong, ZTT, SDG, Fiberhome, Etern, LIGHTERA, WASIN FUJIKURA, SEI Optical Fiber, Inlight, FIBERSIGHT, Far East Communication, rihai Communication, Shijia Photons, Youngsun Com...
- Switch and Server: H3C, Ruijie Networks, Fiberhome, Advanced Fiber Resources, Taclink, Visint, BAUD, ISEELINK, Triple-Stone, Glsun, Asterfusion, Fengrunda, Innovation Shengwei, Beeplux, Sirivision...
- Shenzhen International Electronics & Embedded Systems Expo (elexcon) ——The exhibition completes the terminal supporting hardware for AI computing clusters. Focusing on high-speed storage modules, high-power managements, power semiconductors, embedded edge AI mainboards, and high-speed interconnection components, the exhibition addresses the high-throughput and high-density power supply demands of ultra-large-scale intelligent computing data centers while delivering comprehensive hardware solutions across complete systems, board card and embedded system.
Featured Exhibitors
- Memory Chip: Yangtze Memory, Masonsemi, Netac, Yangtze Memory, Dosilicon, Apacer, KEYMOS, Techwinsemi, Yuxin, BOYA, Huaxun, Mindersemi, KingSpec, Smart Memories, Chip Star, ADATA Electronics...
- Embedded System: Advantech, SEGGER, Avalue, Puzhi Electronics, ALINX, ALIENTEK, Toradex, Saintway, Linaro...
- Power Device and Power Supply: Belling, AIPULNION, RHM, XLSEMI, Tritech-MOS, Truesemi, JESTEK, POWER WIDE...
- Connector: Soulin, yxcon, Fosen, Chuanghaoxin, SEEPLUS, Plastron, Wanda, Fvwin...
*Partial exhibitor list in no particular order.
Concurrent Conferences
| Date | Conference | Venue |
|---|---|---|
| September 9ᵗʰ-PM | High-Speed Optical Transmission Technology Innovation in AI Era Forum | 9A, 2nd Floor, Hall 9 |
| September 9ᵗʰ-PM | Optoelectronics Industry Summit —The "Core" Future of Optoelectronics | Conference Room, Hall 13 |
| September 9ᵗʰ-PM | 2026 China MicroLED & CPO Industrial Chain Innovation Development Summit | 14B, 2nd Floor, Hall 14 |
| September 9ᵗʰ-September 10ᵗʰ | The 8th Embedded Technology Conference China 2027 | Conference Room 1, Hall 16 |
| September 9ᵗʰ | SST Technology Innovation & Industry Development Forum | CC105A, 1st Floor, Hall 18 |
| September 9ᵗʰ | AI Data Center Optical-Electrical Integration Innovation Forum: NPO Focus | 101B, 1st Floor, Hall 18 |
| September 9ᵗʰ-September 10ᵗʰ | The 10th SiP Conference China 2026 | 101C, 1st Floor, Hall 18 |
| September 10ᵗʰ | Optical Interconnect Technology for AI Computing Clusters Forum | 9B, 2nd Floor, Hall 9 |
| September 10ᵗʰ | Photonics-Electronics Convergence Technology and Industrial Development Forum | 9C, 2nd Floor, Hall 9 |
| September 10ᵗʰ-AM | Photonics at the Core of the AI Vortex: An Overview of the Industry | Conference Room, Hall 13 |
| September 10ᵗʰ-PM | ePIXfab China-Europe Silicon Photonics Forum | Conference Room, Hall 13 |
| September 10ᵗʰ | Silicon Photonics Industry Summit in the Era of AI Computing Power | Leadership Summit Area-Conference Room, Hall 14 |
| September 10ᵗʰ | Advanced packaging & Testing Technology Forum—From CoWoS to CoPoS: Exploration of Advanced Packaging Technology Evolution and Supply Chain Layout for AI Era | 14C, 2nd Floor, Hall 14 |
*Agenda is subject to change
Three co-located exhibitions bring together comprehensive industrial chain resources spanning consumer electronics and AR/VR. The integrated platform showcases seven key technology sectors—optical imaging & sensing, advanced display, embedded AI, precision connectors, chip & memory, AR/VR product & component, and test & measurement—providing complete coverage of the entire technical pathway for consumer electronics and AR/VR, spanning spatial perceptions, visual interactions, edge intelligences, high-speed interconnections, computing powers & memory, and performance testing. This comprehensive ecosystem empowers innovation and development across the consumer electronics and AR/VR industries:
- Optical Imaging & Sensing: High precision 2D imaging and 3D perception technologies that address critical challenges in image acquisition and spatial interaction recognition
- Advanced Display: Low-power, high-definition, flexible, and immersive visual interfaces for advanced human-machine interaction
- Embedded AI: Edge-based lightweight computing power enabling real-time intelligent processing and adaptive control
- Precision Connector: High-frequency, high-speed miniaturized interconnects designed for compact electronic and electrical architectures
- Chip & Memory: High-performance computing cores and high-speed memory solutions supporting demanding workloads and rapid data operations High-performance computing cores and high-speed memory solutions supporting demanding workloads and rapid data operations
- AR/VR Product & Component: Lightweight near-eye display modules creating immersive mixed-reality interaction experiences
- Test & Measurement: Comprehensive performance validation ensuring product calibration and production reliability control
- International Integrated Circuit Innovation Expo (IICIE) ——Bringing together consumer grade chip and fabless, featuring a comprehensive showcase of core integrated circuit products including AI computing chips, main controller SoCs, Bluetooth BLE RF chips, PMICs, and application specific AI processors.
Featured Exhibitors
INGENIC, Zhaoxin Semiconductor, Montage Technology, Empyrean, Semitronix, AXS Technology, Hercules Microelectronics, Geehy Semiconductor, Starry Stone Tech, Yangtze Mason Semiconductor, Brite Semiconductor, Binarysemi
- China International Optoelectronic Exposition (CIOE) —— Featuring a comprehensive showcase of optical materials and components, optical lenses and modules, 3D vision, LiDAR, spectral sensing, Micro LED, silicon-based OLEDs, microdisplays, optical waveguides, AR/VR all-in-one devices, and more.
Featured Exhibitors
- Optical Material and Component: HOYA, OHARA, SCHOTT, New HuaGuang, Gabrielle-Optech, Lante Optics, Edmund, Crystal-Optech, Grand Unified Optics, Biel Crystal, Yongxin Optics, Nano Macro, Giai Photonics
- Optical Lens and Module: SUNNY, Phenix Optics, Yutong Optical, AAC Optics, Union Optech, TRACE OPTICAL, Hongjing, Goertek, RICOM, Yongxin Optics, COSTAR, CDGM, NORTH ELECTRO-OPTICS, Lante Optics, Grand Unified Optics, LUXSHARE PRECISION
- 3D Vision: ams OSRAM, visionICs, RaySea, RAYSEES, Zhiqiang Vision, ACTUS, Maxic
- Spectral Sensing: SPECONE, CHNSpec, Hyperstecpral Imaging, Spectrum On-chip, Unispectral, DOSPECTRUM, Qiushi Spectrum, spectricon, Magnity, choptics, Wayho, Westlake Intelligent Vision, Guangyin Technology, OptTrace, Spectricity NV, Rudeer, HLT
- Micro LED & OLED: Crystal-Optech, VIJO, HONGXI TECHNOLOGY, Sitan Integrated Circuit, LUMICORE, Rayvision, Raysolve, Innovision, SeeYA, GUO ZHAO OPTOELECTRONICS, BCDTEK, CHIPDISPLAY, Enkris Semiconductor, Stufo
- Optical Waveguide & AR/VR: AINSTEC, LUXSHARE PRECISION, Goertek, Shoujing Technology, Raypai, AAC Optics, Goowave, ELEPN Projection, North Ocean, Xvisio Technology, InsEye, Raontech, Hongshi Intelligent, MyRias, IIIusion, Gravity, conant, Weiyu Optics, Brilliance, TIMEMAKER, Moldnano, Tobii
- Optical Testing & Measurement: Keyence, CARL ZEISS, TAYLOR HOBSON, ZYGO, Bruker, Panasonic, TRIOPTICS, Mitutoyo, Hexagon, Chotest, ATOMETRICS, ideaoptics, DZOPTICS, Yuchuan Optics, MARPOSS, interfero, GOOD VISION, XingQing, ToupTek, AcroBeam, ZC, TUOJIE, MOTIC, SHUMIN, HUAZHONG PRECISION, Zhiyuan Kefeng, Optical Metrology, OTO PHOTONICS
- Shenzhen International Electronics & Embedded Systems Expo (elexcon) ——Deeply focused on the electronics hardware and systems, covering the full spectrum of electronic components, memory chips and modules, power semiconductors, power solutions, edge embedded AI, connectors, and other foundational hardware, completing the underlying supply chain for end user products.
Featured Exhibitors
- Chip and Module: HDSC, GZLG, MindMotion, Codefairsemi, Suo Micro, Lingyange, FDMTEK, Waytronic, NineChip
- Embedded: Advantech, SEGGER, Avalue, Puzhi Electronics, ALINX, ALIENTEK, Toradex, Saintway, Linaro
- Electronics Component: Jingquanhua, UNI ROYAL, Weirong, EYANG, Shenzhen Huaqiang, YXC, Sunway Communication, Dehong induction, SUSUMU, XTY, Hretech, FOSAN, Aoyuda, HUASUN, YJYCOIN, Houwei Electronics, Junkang Electronics, Cstec
- Power Supply: Jingquanhua, Belling, AIPULNION, RHM, XLSEMI, Tritech-MOS, Truesemi, JESTEK, POWER WIDE
- Connector: Soulin, yxcon, Fosen, Chuanghaoxin, SEEPLUS, Plastron, Wanda, Fvwin
*Partial exhibitor list in no particular order.
Concurrent Conferences
| Date | Conference | Venue |
|---|---|---|
| September 9ᵗʰ-PM | Global Spatial Computing Industry Forum | Conference Room, Hall 2 |
| September 9ᵗʰ-PM | AR/VR Optical Technology Application Summit Forum | 2B, 2nd Floor, Hall 2 |
| September 9ᵗʰ-PM | 2026 Smart Home Development Trends Forum | 6A, 2nd Floor, Hall 6 |
| September 9ᵗʰ-PM | 2026 RISC-V Industry Ecosystem Conference | 14C, 2nd Floor, Hall 14 |
| September 9ᵗʰ-PM | 3rd AI-Enabled Consumer Electronics Innovation Forum | Conference Room, Hall 14 |
| September 9ᵗʰ-September 10ᵗʰ | The 8th Embedded Technology Conference China 2027 | Conference Room 1, Hall 16 |
| September 10ᵗʰ-AM | Edge AI Chip Power: 2026 Smart Terminal Chip Ecosystem Summit | Conference Room, Hall 14 |
| September 10ᵗʰ | Global Microdisplay Industry Development Forum | Conference Room, Hall 2 |
| September 10ᵗʰ | AI AR Glasses Industry Development Forum | 2C, 2nd Floor, Hall 2 |
| September 10ᵗʰ-PM | Handheld Intelligent Imaging Device Technology Development Forum | Conference Room, Hall 3 |
| September 10ᵗʰ-PM | Source of Intelligent Computing: 2026 Chip Computing Power Innovation Summit | Conference Room, Hall 14 |
| September 11ᵗʰ-AM | Large-Scale Interaction and Immersive Experience Technology Summit | Conference Room, Hall 2 |
| September 11ᵗʰ - AM | Optoelectronics-Driven New Quality Productive Forces in Low-Altitude Economy Forum | Conference Room, Hall 7 |
*Agenda is subject to change
Featured Zones
- XR Glasses Teardown Zone – Hall 2；
- Telescope and Astronomical Equipment Zone – Hall 3
- RISC-V Ecosystem + Application Zone – Hall 14
- AI + Application Zone – Hall 14
Three co-located exhibitions bring together the entire intelligent automotive industry chain, offering a comprehensive showcase of automotive optical communications, multi-sensor fusion solutions, automotive displays, automotive three-electric systems (battery, motor, and electronic control), and automotive wiring harnesses. Five key technology segments provide full coverage of the intelligent automotive technology chain - from perception and high-speed transmission to power supply, automotive wiring, and cockpit interaction:
- Automotive Optical Communication: Delivering up to 100 Gbps lossless data transmission to address the high-bandwidth challenges of advanced autonomous driving.
- Multi-Sensor Fusion: Enabling all-weather, round-the-clock precision environmental perception while eliminating blind spots inherent to single-sensor systems.
- Automotive Display: Creating immersive human-vehicle interaction experiences within the cockpit.
- Three-Electric Systems: Providing stable, reliable power to support EV range, fast charging, and the operation of all onboard intelligent hardware.
- Lightweight, High-Shielding Wiring Harnesses: Optimized for next-generation centralized electronic and electrical architectures.
- International Integrated Circuit Innovation Expo (IICIE) ——Bringing together chip and IC design manufacturers, IICIE covers MCUs, SoCs, motion control chips, and security encryption chips, alongside automotive-grade wafer manufacturing and high-reliability packaging. A dedicated AI + Automotive Electronics Application Zone will feature leading companies from the chip and solution provider ecosystem.
Featured Exhibitors
INGENIC, Zhaoxin Semiconductor, Montage Technology, Empyrean, Semitronix, AXS Technology, Hercules Microelectronics, Geehy Semiconductor, Starry Stone Tech, Yangtze Mason Semiconductor, Brite Semiconductor, Binarysemi
- China International Optoelectronic Exposition (CIOE) ——Automotive Highlights：The exhibition covers three major automotive-related sectors including automotive optical communication, automotive perception, and automotive display. Featured products include optical chips, optical modules, automotive-grade optical fiber harnesses, automotive cameras, in-vehicle infrared night vision systems, 3D vision perception solutions, LiDAR, smart cockpit displays, and Mini/Micro LED, among others.
Featured Exhibitors
- Automotive Cameras: SUNNY, Union Optech, Yutong Optical, Phenix Optics, AAC Optics, TRACE OPTICAL, FOCtek, COSTAR, Hitronics... SUNNY, Union Optech, Yutong Optical, Phenix Optics, AAC Optics, TRACE OPTICAL, FOCtek, COSTAR, Hitronics...
- 3D Vision: ams OSRAM, visionICs, RaySea, RAYSEES, Zhiqiang Vision, Maxic, ToFFuture, SLAMTEC, Lucidus, Litra, SMiTSense, Lanhai Photoelectricity...
- Infrared Night Vision: Guide Infrared, Raytron, DALI TECHNOLOGY, FJR, NORTH NIGHT-VISION, HIKMICRO, Pixfra, ZHONGXING TIMES, Kunteng Photonics, Huaguo Optical, SHENZHI WEILAI, Vital Optics...
- Automotive Display: Crystal-Optech, Saphlux, SMARTVISION, Sitan Integrated Circuit, LEKIN, Raysolve, SeeYA, LUMICORE, Westlake Smoky Mountains, BCDTEK, HONGXI TECHNOLOGY, Innovision...
- Chip & Module: COHERENT, Poncan, Guangpu Electronics, Accelink, PHOGRAIN, Dogain, Dapu Telecom, MITSUBISHI, Sanan Optoelectronics, EVERBRIGHT, QXP, Guangte, CETC, Silux, China Science Photon Chip, San-U, Dioo Microcircuits, UX lC, Minisilicon, SUNA, Liturex, EOCHIP, Ferrotec, Glostar, Beogold, Shengda, Advanced Thermoelectric...
- In-Vehicle Network: YOFC, Fiberhome, Kepteck, HGGENUINE, CORNING, OE Photonics, LTK Electric Wire, Etern, Huasheng Futao...
- Shenzhen International Electronics & Embedded Expo (elexcon) ——Covering automotive-grade and robotics hardware solutions, elexcon features automotive-grade passive components, in-vehicle power management ICs, servo drive power devices, robotic embedded motion control boards, industrial-grade high-speed connectors, wide-temperature storage modules, and edge real-time control systems. The exhibition delivers comprehensive hardware solutions for automotive electronic control and robot system integration.
Featured Exhibitors
Advantech, Yangtze Memory, SEGGER, HDSC, MindMotion, Belling, Netac, Dosilicon, Techwinsemi, Apacer, Sunway Communication, Weirong, Jingquanhua, EYANG, UNI ROYAL, GZLG, Avalue, NineChip
*Partial exhibitor list in no particular order.
Featured Exhibitors
| Date | Conference | Venue |
|---|---|---|
| September 9ᵗʰ-PM | The 5ᵗʰ Automotive Camera Technology and Testing Forum | 1B, 2nd Floor, Hall 1 |
| September 9ᵗʰ - PM | 2026 RISC-V Industry Ecosystem Conference | 14C, 2nd Floor, Hall 14 |
| September 9ᵗʰ-September 10ᵗʰ | The 8th Embedded Technology Conference China 2026 | Conference Room 1, Hall 16 |
| September 9ᵗʰ | New Energy Vehicle Electronics Innovation Forum | CC105B, 1st Floor, Hall 18 |
| September 10ᵗʰ | The 8ᵗʰ Intelligent Vehicle Technology Forum | 5C, 2nd Floor, Hall 5 |
| September 10ᵗʰ | The 41st MEMS Seminar: 3D Sensing and Imaging Technology Application | 6B, 2nd Floor, Hall 6 |
| September 10ᵗʰ | Automotive Optical Communication Technology Innovation and Application Forum | 9A, 2nd Floor, Hall 9 |
| September 10ᵗʰ | Automotive Chip Industry Innovation Forum | 14B, 2nd Floor, Hall 14 |
*Agenda is subject to change
Featured Zones
- Automotive Display Zone - Hall 2
- Automotive Optical Communication Live Demonstration Pavilion - Hall 13
- Automative Chip Zone - Hall 14
- AI+ Automotive Electronics Application Zone - Hall 14
Embodied Robot Industry
Three co-located exhibitions unite to present a comprehensive suite of core hardware and software solutions: vision perception modules enable object recognition, human-robot interaction, and close-range environmental detection; power devices manage power conversion and servo motor control, directly determining robotic motion performance, endurance, and overall weight efficiency; connectors and wiring harnesses simultaneously support dual-channel transmission for both power delivery and high-speed data; and the full-stack chip portfolio builds the complete computing architecture for the robot — serving as the "decision-making brain, motion control cerebellum, and sensory neural network."
Featured Zone
A dedicated Embodied Robot Zone will be located in Hall 6 of CIOE, bringing together leading industry players including AUBO, GALAXYCORE, GENISOM AI, HASCO, LANHAI PHOTOELECTRICITY, RISONG, and more.
*Partial exhibitor list in no particular order.
Three co-located exhibitions bring together the complete intelligent manufacturing value chain, offering a comprehensive showcase of semiconductor materials, semiconductor equipment, semiconductor manufacturing and packaging services, precision optical processing, lasers and laser equipment, industrial embedded systems, core parts, and test & measurement. The platform comprehensively covers the full spectrum of semiconductor and intelligent manufacturing – from semiconductor manufacturing, packaging & testing, precision optical processing, vision inspection, to laser manufacturing – enabling enhanced quality, efficiency, and flexible, intelligent upgrades.
- Semiconductor Material: Provide the foundation for chip manufacturing, supporting wafer processing, chip interconnection, and advanced packaging.
- Semiconductor Equipment: Wafer fabrication and packaging & testing equipment, securing the supply base of core chips for advanced applications.
- Wafer Fabrication, Packaging & Testing Service: Covering wafer fabrication and advanced packaging processes, enabling chip process iteration and scaled mass production.
- Test & Measurement: Full spectrum inspection, calibration, and metrology to ensure equipment accuracy and robust production quality control.
- Industrial Vision: High-precision machine vision for in-line inspection, positioning, and measurement on production lines.
- Precision Optical Manufacturing: Micro- and nano-level, high-precision machining to meet the complex shaping requirements of precision components.
- Lasers & Laser Processing & Manufacturing: High energy laser processes enabling cutting, welding, marking and surface treatment.
- Industrial Embedded System: High reliability edge computing power, supporting production line computation and equipment coordination.
- Core Parts & System: High end functional modules ensuring long term, stable operation of intelligent equipment.
- International Integrated Circuit Innovation Expo (IICIE 2026) ——The exhibition will feature a dedicated showcase of core parts including precision machinery and structural components, flow/pressure control systems, RF/power modules, motion control systems, machine visions, sensors, and more. Bringing leading semiconductor equipment manufacturers together under one roof, the expo serves as a launchpad for automation equipment suppliers to move into the high-end segment. Through on-site demonstrations of advanced semiconductor equipment and precision production lines, complemented by targeted technical matchmaking, manufacturers will gain first-hand insight into the industry’s stringent standards and evolving requirements. This exposure enables them to rapidly close gaps in technology, process capability, and application deployment, accelerating efficient entry into the high-end semiconductor equipment market.
Featured Exhibitors
- Semiconductor Material: NSIG, Anji Microelectronics, Peric, Shanghai Sinyang, UPERMARSK, XILONG SCIENTIFIC, Chengdu Carbon...
- Semiconductor Equipment: NAURA, AMEC, ACM RESEARCH, PIOTECH, Heyan Technology, Hwatsing, Aspiring, Huayu Semiconductor, Longyoude, Jingce Electronic, CETC, U-PRECISION, SKYVERSE, Maxwell, DJEL, VEGA TECHNOLOGY, Mitutoyo, R.D.S, Winmax...
- Wafer Fabrication, Packaging & Testing Service: HLMC, Nexchip, BYD SEMICONDUCTOR, TONGFU MICROELECTRONICS, MXTronics, NCAP China, BIWIN Storage Technology, Centraway, iA Semiconductor...
- Semiconductor Core Parts & Intelligent Manufacturing Solution: SKY, SSME, Vacree, HIWIN, KL Group, Canrill, SPECK, KEYENCE, GY-Technology, Omat, STARCHAIN, XINGQI...
- China International Optoelectronic Exposition (CIOE 2026)——It will showcase high precision industrial lenses, industrial sensors, 2D/3D machine vision cameras, lasers and laser system for marking, cutting, and welding, spectral inspection instrument, infrared measurement devices, optical coating equipment, optical systems, and more - all used in precision manufacturing for defect inspection, dimensional metrology, and automated positioning.
Featured Exhibitors
- Wafer Fabrication & Packaging & Testing Equipment: GlobalFoundries, Tower Semiconductor, United Nova, CUMEC, PIC, ASTRO PLASMA, ASMPT, JEOL, Raith, E-Globaledge, Samco, Navikey Semiconductor, ALL-SEMI MICRO, SEMC, Therlicon, Yantai Huachuang, Finetech, MRSI (Mycronic Group), MKS, OXFORD INSTRUMENTS, iN-Cube, Colibri, Mingseal Robot, GKG, QUlCK, Qting, Superwave, CHENGFENG, Opto-Intel, MPI, UIGreen, SEMISHARE, PI, ORIENTAL MOTOR, ACS Motion Control...
- Lasers & Laser Processing: IPG, Raycus, Han's Tiancheng Semiconductor, EVERBRIGHT, Maxphotonics, Light Conversion, Litilit, Photonics Laser, Luxinar Laser, HUAGUANG, GLORY PHOTONICS, Crystrong, GONGDA LASER, INNO LASER, ZOLIX INSTRUMENTS, Inngu Laser, HGGENUINE, United Winners Laser, HYMSON LASER, INTE LASER, LASERVALL, Yuzhiquan, ANEWBEST, Vi Laser, Guluo, CKD, Newlaz, Zmotion, QIGO, FEELTEK, Trace puint laser, HUANLI...
- Intelligent Equipment & Industrial Automation: HGGENUINE, CFMEE, Misumi, GuiHua, TOYO AUTOMATION, SIMAX, Kurtz Ersa, GOANWIN, TGB, MOJI-NANO, FREEGES, MAXAIR, Arison, MUSASHI, Shinwa, Flexem, KAIFULL, SuperFar, Aihefa, YESSYS, MultiFields, Jetran… HGGENUINE, CFMEE, Misumi, GuiHua, TOYO AUTOMATION, SIMAX, Kurtz Ersa, GOANWIN, TGB, MOJI-NANO, FREEGES, MAXAIR, Arison, MUSASHI, Shinwa, Flexem, KAIFULL, SuperFar, Aihefa, YESSYS, MultiFields, Jetran…
- Intelligent Equipment & Industrial Automation: HGGENUINE, CFMEE, Misumi, TOYO AUTOMATION, GuiHua Intelligent, SIMAX, Kurtz Ersa, GOANWIN, Sunny Technology, HEIGHT PRECISION, TGB Precision, Like Automation, MOJI-NANO, FREEGES, MAXAIR, Ruan Electronics, Arison, MUSASHI, Shinwa, Flexem, KAIFULL, JinYuan Hardware, SuperFar lntelligent, Aihefa, YESSYS, MultiFields, Zhuochuang, Jetran, WANHE, Yongxiangshun...
- Precision Optical Processing: AMETEK Precitech, DKSH, Satisloh, Cranfield Precision, Nextas, Ultra Precision Nano, High-precision Technology, Bozhongtaida, Huacui, Shengong Technology, GermanLitho, Shibaura Machine, Schneider Electric, DKSH, Shangneng Precision, Damin Chandon, Langxin Optics, XIBIN, Hengtai, Genertec...
- Optical Coating Equipment: Bühler Leybold, OPTORUN, IBD, HuiCheng Vacuum, HANA, AVP, IZOVAC, Tianyi Guotai, SHINCRON, Youlun Vacuum, Gilitek, Sinoprime, SHOWA SHINKU, HANA, Keymang, Pilot, YOUZHEN, Tianyi Guotai, Soleras, Nanofilm Vacuum, Xingnan, YUNMAO, SINO MULTI-MICRO, Longway, Hongpu...
- Infrared Testing & Measurement: Thorlabs, Optris, Golden Way, Zhenxing, HGH, East Technology, UTOP-SINO, B&W TEK, IES, Yingda Hi-Tech, I-TEC, HGH, B&W TEK, Taian Demei, Super Source, IntelliMeasure...
- Industrial Sensor: Micro-Epsilon, Stella, ODTech, Hamamatsu, BRIGATES, Light-Catcher, Guangyin Technology, WING CHIP, siman sensor, Haomo, Ysenser, Inxun, Beephoton, NB Technology, LECHENG, KODENSHI, Atto Motion, Time Vision...
- Shenzhen International Electronics & Embedded Expo (elexcon 2026) ——The show builds the hardware foundation for intelligent manufacturing, presenting a comprehensive lineup of industrial embedded motherboards, PLC core controllers, servo drive power supplies, industrial grade components, high reliability connectors, wide temperature storages, and industrial IoT gateways. The expo highlights standardized production line control and edge computing solutions that scale across automation lines in 3C, semiconductor, and new energy sectors.
Featured Exhibitors
Advantech, Avalue, SEGGER, ALIENTEK, Toradex, ZLG, SEGGER, ALINX, Puzhi Electronics, Saintway, Jingquanhua
*Partial list of companies in no particular order.
Concurrent Conferences
| Date | Conference | Venue |
|---|---|---|
| September 11ᵗʰ-AM | Advanced Optics and Intelligent Sensing Technology Forum | 1C, 2nd Floor, Hall 1 |
| September 9ᵗʰ-PM | Laser Micro and Nano Processing Advanced Manufacturing Forum | 2C, 2nd Floor, Hall 2 |
| September 9ᵗʰ-PM | Laser Technology Empowering Semiconductor Industry Manufacturing Forum | 2A, 2nd Floor, Hall 2 |
| September 9ᵗʰ-PM | Laser Welding for Smart Manufacturing Innovation Application Forum | Conference Room, Hall 4 |
| September 9ᵗʰ-PM | Optical Semiconductor Inspection Technology Forum | 5B, 2nd Floor, Hall 5 |
| September 9ᵗʰ-PM | Nanoimprint Manufacturing Technology Forum | 5C, 2nd Floor, Hall 5 |
| September 9ᵗʰ-PM | Advanced Material Innovation Forum—Breaking Through the Limits -Key Materials for AI Heterogeneous Integration Packaging | 13A, 2nd Floor, Hall 13 |
| September 9ᵗʰ-PM | 2026 Intelligent Manufacturing Innovation and Development Conference | 14A, 2nd Floor, Hall 14 |
| September 9ᵗʰ-PM | Core Semiconductor Manufacturing Equipment and Components Development Forum | Conference Room, Hall 16 |
| September 9ᵗʰ-September 10ᵗʰ | The 8th Embedded Technology Conference China 2026 | Conference Room 1, Hall 16 |
| September 10ᵗʰ | IWAPS International Workshop on Advanced Patterning Solutions | Mangrove A, Second Floor, South Lobby |
| September 10ᵗʰ-AM | Meta-optical & Micro-nano Optical Manufacturing Technology Forum | 5A, 2nd Floor, Hall 5 |
| September 10ᵗʰ-PM | Optical Ultra-precision Manufacturing Forum | 5A, 2nd Floor, Hall 5 |
| September 10ᵗʰ | Optics Vacuum Coating Forum | Conference Room, Hall 7 |
| September 10ᵗʰ | Advanced packaging & Testing Technology Forum—From CoWoS to CoPoS: Exploration of Advanced Packaging Technology Evolution and Supply Chain Layout for AI Era | 14C, 2nd Floor, Hall 14 |
| September 10ᵗʰ | Intelligent Industrial Control Empowering Automation Innovation Forum | Conference Room, Hall 15 |
| September 10ᵗʰ | Compound Semiconductor Advanced Packaging & SiC Embedded PCB Supply Chain Forum | Conference Room, Hall 16 |
| September 11ᵗʰ | IWAPS International Workshop on Advanced Patterning Solutions | 5AB, 2nd Floor, Hall 5; 6AB, 2nd Floor, Hall 6; 9AB, 2nd Floor, Hall 9 |
| September 11ᵗʰ-AM | 2nd Edge AI and Intelligent Control Technology Industry Forum | Conference Room, Hall 15 |
| September 11ᵗʰ-AM | Semiconductor Clean Utility & Energy Management Forum | Conference Room, Hall 16 |
*Agenda is subject to change
Featured Zones
- Laser Welding Zone - Hall 2
- Sapphire Processing & Application Zone - Hall 3
- Optical Injection Molding / Molded Aspheric Zone - Hall 3
International Integrated Circuit Innovation Expo (IICIE): Spanning the Complete Integrated Circuit and Semiconductor Manufacturing Value Chain
The exhibition showcases a comprehensive ecosystem encompassing chip and IC design, wafer fabrication, packaging & testing equipment, core parts and materials. Attendees can engage directly with semiconductor industry leaders across IDM, fabless, fab, and OSAT, while connecting with professionals from artificial intelligence, consumer electronics, automotive, communications and computing, display, photonics, and new energy. IICIE provides efficient, one-stop platform for business connections, matchmaking, and industry exchanges.
China International Optoelectronic Exposition (CIOE): A Comprehensive Platform Covering the Entire Optoelectronics Value Chain
CIOE brings together over 4,000 exhibitors from more than 30 countries and regions worldwide. The exhibition features eight expos covering information and communications, precision optics, camera technologies and applications, lasers and intelligent manufacturing, infrared, ultraviolet, intelligent sensing, display, AR & VR, and photonics innovation. CIOE serves as a one-stop, efficient procurement platform for industry professionals to source materials, components, equipment, and solutions. It also functions as a strategic business platform for business matchmaking, networking, and staying ahead of industry trends and developments.
Shenzhen International Electronics & Embedded Systems Expo (elexcon): Focused on Embedded Hardware and Electronic Components
As the premier professional event dedicated to electronic components and embedded technologies, elexcon highlights cutting-edge products spanning embedded and edge AI, memory chip and module, power and power supply, electronic component, high-speed connector, and more. The exhibition creates a specialized platform for product sourcing and technical exchange, designed specifically for hardware engineers, embedded developers, procurement professionals, and industry decision-makers.
